Interlayer reinforcement for improved mechanical reliability for wearable perovskite solar cells
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作者:Weilun Cai, Pengchen Zou, shigi rong, Hui Wang, Xin Chen, ZhengZhang, yajie wang, Chou Liu, Tinghuan Yang, TiangiNiu, Shengye Jin, Wenming Tian, Jianxi Yao, Shengzhong FrankLiu and Kui zhao
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发布时间: 226天前
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917 次浏览
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Weilun Cai, Pengchen Zou, shigi rong, Hui Wang, Xin Chen, ZhengZhang, yajie wang, Chou Liu, Tinghuan Yang, TiangiNiu, Shengye Jin, Wenming Tian, Jianxi Yao, Shengzhong FrankLiu and Kui zhao, Energy & Environmental Science, 2024, D4EE03503H.
Abstract:
Flexible perovskite solar cells (F-PSCs) are emerging as a promising solution for weightsensitive, wearable, portable, and flexible applications. However, F-PSCs still suffer from poor
mechanical reliability due to weak interlayer adhesion and stress mismatch. In this study, we
present a successful approach using a polyacrylamide (PAM) interlayer at the buried interface
to alleviate interfacial stress mismatch, enhance interfacial adhesion for mechanical stress
dissipation, and regulate perovskite crystallization dynamics. The phase transition from the
non-perovskite δ-phase to the perovskite α-phase, from the buried interface to the bulk film,
was observed using in-situ grazing-incidence wide-angle scattering (GIWAXS), which
synergistically improves film quality and charge extraction. We achieved solar cells with
efficiencies of 24.83% for a 0.06 cm² cell (certified 24.41%) and 17.46% for a 20 cm² module,
with an exceptional specific power density of 1745 W/kg, all of which are among the highest
in their respective categories. Importantly, the resulting devices exhibit significantly improved
mechanical reliability under six types of stress conditions in real-world scenarios, maintaining
95% efficiency after 7000 bending cycles. This improved mechanical reliability is attributed to
the enhanced stress dissipation ability, which helps maintain structural integrity and charge
extraction, as evidenced by GIWAXS mappings and photocurrent imaging mappings.
http://doi.org/10.1039/D4EE03503H